Printed Circuit Board Design Engineer

Title – PCB layout Engineer Location – Remote The ideal candidate should have strong relevant and recent technical and hands-on background and be able is hit the ground running as an individual contributor Contribute to, or lead, PCB and package substrate layout development for leading-edge optical communication products. Ensure compliance with IPC standards, company design practices, and fabrication capabilities. Collaborate with electrical, mechanical, thermal, signal-integrity, power-integrity, and manufacturing teams. Work with PCB fabricators, and substrate vendors to close DFMs. Minimum Requirements Bachelor’s degree or equivalent certifications with a minimum of 10+ years of relevant industry experience in PCB board and/or package substrate layout engineering. Expert-level proficiency with Cadence Allegro PCB design tools Strong demonstrated working experience of complex high-density, high-speed PCB and substrate designs using advanced HDI, stacked micro-via, sequential lamination, and fine-pitch BGA technologies. Hands-on experience with complex multilayer high-density organic substrates, fine-pitch BGAs, and advanced component packages. Working understanding of transmission line layout geometries and rules (micro strip, strip line, CPW, etc.) Demonstrated experience in layout of compact low voltage and high current multiphase DC-DC power converters for state-of-the-art processors and GPUs Strong understanding of PCB fabrication, assembly processes, DFM, and manufacturing tolerances. Demonstrated success delivering high-volume, high-reliability communication products under aggressive schedules.