[Remote] XPU Business Development Leader

Note: The job is a remote job and is open to candidates in USA. TylSemi develops chiplet infrastructure IP, including I/O, power delivery, and interconnect building blocks for AI and high-performance computing systems. The XPU Business Development Leader will develop strategic customer accounts and ecosystem relationships, translate customer platform requirements into product and roadmap inputs, and support commercial and industry engagement.

Responsibilities

• Identify, qualify, and develop strategic accounts — hyperscalers, AI compute companies, and infrastructure semiconductor customers — from first contact through proposals and commercial agreement
• Engage customer architecture, platform, and procurement teams at the technical level; translate AI chip and chiplet platform requirements into actionable product specs for R&D
• Own the ecosystem partner map — IP vendors, OSATs, packaging partners, and foundry ecosystem programs; establish and maintain working relationships that support product and tape-out execution
• Drive participation in industry standards bodies and chiplet consortia (UCIe Consortium, PCI-SIG, CXL Consortium, OCP, IEEE, JEDEC etc.) to build visibility and influence roadmap alignment
• Develop and manage NDA pipeline, customer evaluation programs, and early-access engagements in coordination with engineering
• Produce and maintain account plans, pipeline tracking, and BD status reporting for leadership
• Represent TylSemi at industry events, customer briefings, and technical forums

Skills

• 10+ years in business development, FAE, or customer/product management roles in semiconductors, with direct exposure to advanced AI chips, accelerators, or chiplet-based silicon
• Established relationships across hyperscaler silicon teams, AI chip startups, or custom ASIC customers; able to open doors at the architecture level, not just procurement
• Experience working the ecosystem side: IP vendors, foundry BD programs, OSAT, or packaging partners
• Track record of moving deals from first contact to signed agreement in a technical, long-cycle semiconductor sales environment
• Comfortable operating without a large support structure — this role owns its own pipeline, materials, and follow-through
• FAE or CPM background strongly preferred — technical depth to engage R&D and platform teams credibly on chiplet integration, UCIe, PCIe, or power delivery topics

Benefits

• Remote-friendly work; US team members may be hired regardless of location (Bay Area preferred).

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